News
Blog Review: July 15
1+ hour, 58+ min ago (343+ words) PCIe ATS verification; physical AI; adopting AI EDA; custom AMBA Viz plugins; V2G; fab construction workforce. Cadence’s Anupriya K explains how Address Translation Services (ATS) acts as the fast lane for PCIe memory access by caching address translations directly on the…...
AI Models On The Edge
1+ day, 1+ hour ago (128+ words) Customizing NPUs without sacrificing flexibility. The post AI Models On The Edge appeared first on Semiconductor Engineering. Moving from large language models in the cloud to small language models at the edge is much more complicated than just slimming down…...
EDA Revenue Up 12.7%; APAC Roars Back
1+ day, 8+ hour ago (256+ words) Market strength remains in double digits for most categories. Worldwide EDA and semiconductor IP revenue reached $5.748 billion in Q1 2026, a 12.7% increase compared to the same period in 2025. The key driver continues to be demand for tools used to create AI server…...
Change Is Tough
2+ day, 1+ hour ago (563+ words) There has never been a time when change has become something everyone expects. Now we are figuring out what it means to us individually. The reality is that it probably was first said by an unknown junior engineer when told…...
Startup Funding: Q2 2026
2+ day, 1+ hour ago (1264+ words) Plenty of cash for AI and its enablers; 80 startups raise over $6B. The post Startup Funding: Q2 2026 appeared first on Semiconductor Engineering....
Open DRAM Model For PIM Analysis In 3D DRAM (Georgia Tech)
2+ day, 14+ hour ago (201+ words) Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling Processing-in-Memory in 3-D DRAM.” Abstract Excerpt: “In this work, we present an “Open DRAM Model” that enables comprehensive circuit-level analysis of DRAM operations…...
Chip Industry Week In Review
5+ day, 1+ hour ago (495+ words) The memory maker rolled out a slew of announcements this week, including: Amkor SVP David McCann (L) and ASE VP of R&D CP Hung (R) discuss future challenges and directions for advanced packaging at iMAPS CHIPCon conference in Santa Clara, California....
The Expansion Of LPDDR Into Edge AI Platforms
6+ day, 1+ hour ago (469+ words) Paul Karazuba is Vice President of Marketing, Silicon IP at Rambus, where he oversees marketing and partnerships for the Silicon IP business unit. Previously, he served as Vice President of Marketing at Expedera, helping bring cutting-edge technology to market in…...
AI Is Rewriting The IP Playbook
6+ day, 1+ hour ago (1355+ words) As the semiconductor ecosystem pivots to AI, it is transforming how IP is created, verified, managed, and sold. AI is becoming part of the everyday work of IP developers who build, verify, package, support, and sell reusable design blocks. It…...
Unifying Software And Semiconductor Development
6+ day, 17+ hour ago (247+ words) Redefining IP lifecycle management by uniting silicon and software to deliver traceability, automation, and AI-ready design flows. The post Unifying Software And Semiconductor Development appeared first on Semiconductor Engineering. In this white paper, we will discuss the emerging trend in…...